CCL technology upgrade: high frequency and high speed

Copper clad laminate is the core material for making printed circuit boards, and it is responsible for the three functions of conductive, insulating and supporting printed circuit boards. The copper clad laminate industry has experienced several major and far-reaching technological transformations and upgrades, which are the "lead-free and halogen-free" driven by environmental protection requirements, the improvement of circuit integration, the "light and thin" driven by miniaturized smart terminals, and the promotion of communication technology. "High frequency and high speed", among them, the first two have already occurred, and "high frequency and high speed" is exerting influence with the progress of 5G communication.

With the upgrade of 5G communication technology, the communication frequency and transmission rate have been greatly increased, and the electrical performance requirements of copper clad laminates have been greatly improved, which will promote the "high frequency and high speed" of the copper clad laminate industry. In the 5G era, the communication frequency has risen to 5GHz or above 20GHz, and the transmission rate has reached above 10-20Gbps. The electrical performance requirements of the copper clad laminate industry have been greatly improved. Most of the common copper clad laminate application frequencies are concentrated below 1GHz.

The main requirements of 5G communication equipment for the electrical performance of copper clad laminates are low dielectric constant (Dk) and low dielectric loss factor (Df). The industry divides copper clad laminates into six grades according to Df. The higher the transmission rate, the lower the required Df value.Taking 5G communication as an example, its theoretical transmission speed 10-20Gbps, the dielectric loss performance of the corresponding copper clad laminate must reach at least the medium and low loss level. The lower the Df, the more technically difficult the material.