Leading PCB Companies Gather! KPCAShow 2025 Grandly Opens!

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Yesterday morning, the 2025 International Advanced Semiconductor Substrate & Packaging Industry Exhibition (hereinafter referred to as KPCAShow 2025) officially kicked off at the Songdo Convensia in Incheon, Korea. The three-day event (September 3–5) is themed “Smart Connectivity · Circuit Innovation,” bringing together 226 global leading enterprises and over 19,000 professional visitors to jointly envision a grand blueprint of PCB technology, intelligent manufacturing, and cutting-edge technological integration.

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The opening ceremony attracted large-scale participation from representatives across industry, academia, and research sectors. The ribbon-cutting highlighted the collective strength and underscored the industry’s strong focus on the rapidly emerging advanced semiconductor substrate and packaging sector.

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As Korea’s only and largest professional exhibition for PCB and semiconductor packaging, KPCAShow has drawn participation from major Korean PCB manufacturers including Samsung Electro-Mechanics, LG Innotek, Daeduck Electronics, and Simmtech, as well as leading semiconductor back-end engineering companies such as STATS ChipPAC Korea and Hana Micron. Particularly noteworthy this year is the spotlight on glass substrates, which have emerged as a core theme. Many leading manufacturers and equipment providers in this field are joining on a large scale, attracting widespread industry attention.

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China, as the world’s largest PCB manufacturing base, also showcased its strength, with prominent domestic brands such as Han’s CNC and Xinji Microelectronics traveling to Korea to demonstrate the strong capabilities of China’s PCB industry.

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During the exhibition, INSIGHT2025 (International Symposium) hosted by KPCA invited domestic and international scholars to explore new opportunities under the theme “Where AI, Integration and Performance Converge.” With 23 specialized sessions, the symposium will highlight the latest advancements and innovations in semiconductor substrates, glass substrates, chips, SoIC, CoWoS, and other next-generation semiconductor packaging solutions.

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This global gathering of expertise and innovation serves not only as a one-stop showcase for advanced PCB technologies, materials, and equipment, but also as a vital platform for buyers, distributors, and manufacturers in the global electronics industry to exchange and collaborate. As the exhibition progresses, it is expected to further accelerate technological advancement and market expansion in the PCB sector, injecting strong momentum into the vision of “Smart Connectivity · Circuit Innovation.”

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#PCBIndustry #SemiconductorPackaging #AdvancedSubstrates #GlassSubstrate #PCBManufacturing #SmartConnectivity #ElectronicsInnovation #PCBAssembly #PCBTechnology #KPCAShow2025